We can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits.
Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography, electroplating, etching, screen printing Isostatic pressure, laser cutting, etc
*Professional suppliers of ceramic thin-film substrates
*Maintains strict process controls and testing parameters to ensure a consistent product on every lot providing optimal value and performance
*Advanced secondary processes like laser machining, polishing, and lapping
Characteristics:
Al2O3 %:≥99.6
Thermal Conductivity:≥30W/m.K@25℃
Size:up to Dia. 8 inch
TCE:7.1 ppm/℃(25-300℃)
Thickness:0.05~2mm,±2%
Surface Finish :
Density:≥3.9 g/cm3
As fired:50-80nm/80-150nm
Water absorption %:0
Lapped:<300nm
Flexural strength:550 MPa
Polished:≤25nm
Dielectric Constant:9.9±0.1@10GHz
Volume Resistivity:≥1*1014 Ω.cm
Dielectric loss tangent:0.0001@10GHz
Dielectric Strength:≥15KV/mm